ZAFS Series
All three models use the same measurement principle. What differs is wafer size, port configuration and whether sorting is included. The ZAFS 4000 adds an eight-port sorter, finishing measurement and sorting in one tool.
Line-up
| Item | ZAFS 4000 | ZAFS 3000 | ZAFS 2000 |
|---|---|---|---|
| Wafer | 300 mm · 200 mm | 300 mm (12″) | 200 mm (8″) |
| Function | Measurement + sorting | Measurement | Measurement |
| Ports | 8 (2 in / 6 out) | 3 | 3 |
| Geometry | Thickness · TTV (GBIR) · Bow · Warp · GFLR | ||
| Electrical | Resistivity · P/N type | ||
| Identification | Front and back OCR, 2 units (standard) | OCR (option) | OCR (option) |
| Diameter | Supported | ||
| Throughput | 55 sec / wafer | depends on configuration | |
| Monthly capacity | 5 units | 10 units | 10 units |
ZAFS 4000 · Specification
300 mm Wafer Flatness Measure & Sorting System
| Parameters | Thickness, TTV (GBIR), Bow, Warp, GFLR |
|---|---|
| Method | Electrostatic capacity, facing upper / lower probe pair |
| R direction | 2 mm pitch |
| θ direction | Selectable, 3 lines or more (set in the recipe) Default 4 line — 0 / 45 / 90 / 135° in the wafer frame |
| FQA | 294 mm or under |
| Thickness range | 600 – 900 µm |
| TTV range | < 300 µm |
| Warp range | < 800 µm |
| Bow range | < 800 µm |
| GFLR range | < 800 µm |
| Resolution | 0.5 µm |
| Repeatability — thickness | ± 0.05 µm measured σ 0.002 – 0.003 µm |
| Repeatability — Warp / Bow | ± 0.5 µm |
| Resistivity range | 1 – 1,000 Ω·cm |
|---|---|
| Resistivity resolution |
100 – 999 Ω·cm → 2 significant digits 10 – 99 Ω·cm → 3 significant digits 1 – 9 Ω·cm → 4 significant digits |
| Resistivity points | Up to 3 per wafer (set in the recipe) |
| P/N type | P or N for wafers of 1 – 1,000 Ω·cm Some coated wafers may not be probeable. |
| Diameter range | 298 – 302 mm |
| Diameter resolution | 100 µm |
| OCR | Front and back, 2 units (within IS1741-11 performance) |
| Wafer | Silicon wafer 300 mm ± 0.2 mm, thickness 0.6 – 0.9 mm |
|---|---|
| Cassette stage | 25 slot · cassette monitoring sensor · cassette barcode reading 2 input stages / 6 output stages |
| Transfer robot | Clean robot, single arm, backside adsorption Ceramic hand · vacuum chuck |
| Measurement stage | PEEK, Teflon (rotary stage part) |
| Aligner | CCD sensor type · vacuum chuck · moves while adsorbing the wafer |
| Scan stage | Linear motor (two motors) |
| Measurement unit | Capacitance sensor + amplifier |
| Outside dimensions | 3,250 (W) × 1,900 (D) × 2,400 (H) mm Indication lamp and LCD not included / cassette stage height approx. 900 mm |
| Main unit material | Outer case steel plate (baking finish) · SUS, Al (alumite) Paint colour white ivory |
| Control unit | PC · UPS |
| Mass | Approx. 1,500 kg |
| Item | Specification |
|---|---|
| Power (GPS) | 220 V, 30 A, 1 phase, 60 Hz, 4 kW |
| CDA | 8π hose ×1, 600 kPa, 100 LPM |
| Vacuum | 8π hose ×1, −60 kPa, 50 LPM |
| Interface | RJ45, 100 Mbps or above, ×1 (external communication) |
| Environment | Cleanroom class |
| Work area | 700 mm front · 700 mm rear · 600 mm side clearance |
| Input | 2 ports |
|---|---|
| Output | 6 ports — Grade 1 ×2 / Grade 2 ×2 / Reject ×2 |
| Sorting criteria | Thickness, TTV, Bow, Warp, GFLR, resistivity, P/N, diameter, OCR ID |
During the auto running test, 100 or more wafers shall be run continuously with no error attributable to the tool.
Beyond the spec sheet
Each item below answers a complaint that came up repeatedly from floors running earlier-generation tools.
Safety
A light curtain on every port. If an operator reaches for a cassette while the tool is running, it is detected immediately, preventing misalignment and breakage. Less space than a door, and no fatigue from opening and closing one.
Stability
Separates the measurement system from external vibration sources. Combined with a granite base, it closes the path by which floor vibration leaks into a micrometre-scale reading.
Cleanliness
Blocks dust ingress and minimises outside influence while the tool runs. An open type, with the cassette section exposed as on earlier tools, is also available.
Throughput
Right after loading, the mapping sensor on the robot reads wafer presence slot by slot in one pass. Empty slots are skipped, removing the loss of reaching into each slot in turn.
Operation
CASSETTE, PROCESSING and START indicators on every port let the operator read progress from in front of the tool, and prevent a cassette being lifted off while it is still being processed.
Operation
A second monitor at the cassette section, in addition to the front one, lets the status be checked from either side of the tool. A wafer protruding from a cassette is also detected.
Control software
Four screens — Measure, Set Recipe, Open Data and Maintenance — cover operation, recipe setting, result review and tool checks.
